Fanless Mini-ITX Case for Intel® LGA1700
Bi-symmetrical extruded fins on either side of the case maximise the surface area of the exterior for increased heat dissipation. Coupled with internally hi-efficient passive thermal module and heat pipes to ensure the Thermal Design Power (TDP) is met.~
True Silent Experience
Fanless CPU design eliminates the need for noisy mechanical fans so that true silence can be achieved. Paired with the use of Solid State Drives, one can truly immerse themselves in the experience of soundless acoustics. Breathability, provided by multi-functional apertures which optimise natural convectional airflow, is fused with contemporary design for a minimalist yet functional case.
Easily adjustable thermal module with 4 copper heat pipes which are universally compatible with Intel® and AMD boards. Superbly engineered for maximum efficiency and ease of use.
Geometrically balanced case features a black anodised aluminium body with diamond-edge finish, combined with bi-symmetrical extruded fins for a beautifully crafted, modern case. Perfect for a wide range of applications and environments.
See Installation Manual link above Click here for optional external charger Click here for optional internal charger
Front I/O: 2 x USB 3.2 Gen 1 Type-A 2 x USB 2.0 Type-A 1 x Power LED 1 x HDD LED 1 x Power button Rear I/O: 2 x Antenna fitting holes 1 x Kensington lock 2 x Serial ports 1 x Power connector
#Hide#Small Form Factor
Power Supply Wattage
Connectors / Controls
See Overview Click here for Installation Manual
2 x 2.5” SSD/ HDD
65W TDP Fanless Aluminium Body 4 x copper heatpipes Bi-symmetrical extruded fins on sides of case
Anodised aluminium body
3.03 kg (WxLxH) 280 x 209 x 110 mm
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